Wednesday, February 20, 2013
DJ: Jan Chip Equip Orders Down 25.2%; BB Ratio 1.18 -SEAJ
TOKYO--Global orders for Japanese semiconductor manufacturing equipment fell 25.2% in January from a year earlier to Y74.32 billion, according to preliminary data released by an industry association Wednesday.
The book-to-bill ratio for Japanese chip-making equipment manufacturers came to 1.18 in the month, above the key 1.00-mark for the second consecutive month, according to the Semiconductor Equipment Association of Japan.
